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IC Design PortfolioSiemens EDA has a comprehensive portfolio of IC design software spanning from C-leveldesign entry to world-class physical verification signoff.Circuit SimulationallAnalog FastSPICE PlatformThe world's fastest nanometer circuit verification platform for analog, RF, mixed-signal, and custom digital circuits.Digital IC implementationallAprisaAprisa is a best-in-class digital implementation solution for complex hierarchical and block-level IC designs at the most advanced process nodes.Physical Verification ToolsallCalibre Design SolutionsCalibre Design Solutions delivers a complete IC verification and DFM optimization platform that speeds designs from creation to manufacturing, addressing all sign-off requirements.HLS & VerificationallCatapultIndustry-leading C++/SystemC High-Level Synthesis with Low-Power estimation/optimization. Design checking, code, and functional coverage verification plus formal make HLS more than mere “C-to-RTL."S-Edit & L-EditallCustom IC The tool suite offers a completed design environment for full custom IC designs including More than Moore technologies – MEMS and photonicsPower Integrity AnalysisallmPower The mPower toolsuite enables design teams to perform scalable analog and digital power integrity analysis from the smallest blocks to the largest full-chip layouts to verify designs meet power-related design goals and performance.Logic Synthesis allOasys-RTLOasys-RTL provides better quality results by enabling physical accuracy, floor-planning, and fast optimization iterations to get to design finalization on time. Power Analysis & OptimizationallPowerProPowerPro is a complete RTL low-power development platform that enables RTL designers to find sources of wasted power and meet design power budgets.FPGA SynthesisallPrecision Precision Synthesis offers high-quality results, industry-unique features, and integration across Siemens EDA’s FPGA flow – the industry’s most comprehensive FPGA vendor-independent solution.ML-Enabled TechnologyallSolido SolutionsOffering the world’s most advanced, production-proven variation-aware design and characterization solutions powered by proprietary machine learning technologies. Test and Silicon Lifecycle allTessent Silicon Lifecycle SolutionsTessent offers design-for-test and silicon learning for logic, memory and mixed-signal devices.IC Verification PortfolioSiemens EDA has a comprehensive verification portfolio for custom, analog and analog mixed-signal as well as digital IC design.Circuit SimulationallAnalog FastSPICE PlatformThe world's fastest nanometer circuit verification platform for analog, RF, mixed-signal, and custom digital circuits.Physical Verification ToolsallCalibre Design SolutionsCalibre Design Solutions delivers a complete IC verification and DFM optimization platform that speeds designs from creation to manufacturing, addressing all sign-off requirements.High-Level VerificationallCatapult Everything you need to accelerate your High-Level Verification flow. Reduce Verification time and costs by up to 80% leveraging Design Checking, Code and Functional Coverage plus Formal.Analog Verification allEldo PlatformIndustry-proven circuit verification platform for analog-centric circuits.Library CharacterizationallKronos High performance, high-throughput cell library characterizer for standard cells, multi-bit cells, and I/O cells.Cost-effective HDL SimulationallModelSim ModelSim’s award-winning Single Kernel Simulator (SKS) technology enables transparent mixing of VHDL and Verilog in one design. Power Integrity AnalysisallmPower The mPower toolsuite enables design teams to perform scalable analog and digital power integrity analysis from the smallest blocks to the largest full-chip layouts to verify designs meet power-related design goals and performance.Logic Verification ToolsallQuesta Questa Verification’s

What is IC substrate?IC substrate (also known as IC package substrate) is a key special basic material used in advanced packaging, which is used to package bare IC (integrated circuit) chips. IC substrate acts as the connection between IC chip and PCB through a conductive network of wires and holes. IC packaging substrate is developed on the basis of HDI / BUM board, or IC packaging substrate is HDI / BUM board with higher density.IC is an intermediate product, which has the following functions:Capture semiconductor IC chip; Internal wiring for connecting chip and PCB;It can protect, reinforce and support IC chips, and provide a heat dissipation channelSignal and power distributionAdvanced technology IC substrates include:CSP (Chip Scale Packages)FC-CSP (Flip Chip) CSPBOC (Board on Chip)PoP (Package on Package)PiP (Package in Package)SiP (System in Package)RF ModuleLED PackageIC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution. IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip-chip methods.With the rapid development of BGA (ball grid array) and CSP (chip level package) and other new ICs, IC substrate has been booming, these ICs need new packaging substrate. As one of the most advanced PCB (printed circuit board), IC substrate PCB, along with any layer of HDI PCB and flexible rigid PCB, has explosive growth in popularity and application. Now it is widely used in Telecom and electronic updates.The birth of IC substrateTraditional integrated circuit (IC) packaging uses a lead frame as the substrate of IC conduction line and supporting IC, connecting pins on both sides or around the lead frame, such as a two-sided pin flat package, four side pin flat package, and so on. When the number of pins is not too much, this packaging method can also meet the requirements. With the development

Of semiconductor technology, the characteristic size of IC is shrinking and the integration degree is improving. The corresponding IC package is developing towards the direction of ultra multi-pin, narrow pitch, and ultra miniaturization. The traditional lead package has been unable to meet the requirements. In the 1990s, a ball grid array (BGA), chip-scale package (CSP), and other new IC high-density packaging methods began to appear, so an IC substrate PCB emerged. Classification of IC substrateAs mentioned above, there are many ways to classify packaging substrates, mainly by packaging process, material properties, and application fields.1. According to the packaging processespackaging substrate can be divided into wire bonding packaging substrate and the flip-chip packaging substrate. 1.1 Classification by bonding technologyWire bondingTABFC bonding1.2 flip-chip packaging substrateBGA IC substrate: The IC substrate performs well in heat dissipation and electrical performance, and can significantly increase the chip pins. Therefore, it is suitable for IC packages with more than 300 pins.CSP IC substrate: CSP is a single chip package, lightweight, small size, with a size similar to IC. CSP IC substrate is mainly used in memory products, telecommunication products, and electronic products with a small number of pins.FC IC substrate: FC (flip chip) is a flip-chip package with low signal interference, low circuit loss, good performance, and effective heat dissipation.MCM IC substrate: MCM is the abbreviation of a multi-chip module. This type of IC substrate absorbs chips with different functions into a package. Therefore, due to its features including lightness, thinness, shortness, and miniaturization, the product can be the best solution. Of course, because multiple chips are packaged in one package, this type of substrate does not perform well in signal interference, heat dissipation, fine wiring, and so on. 2. According to different substrate materialsPackaging substrate can be divided into the rigid board, flex board, and ceramic substrate.Rigid IC substrate: It is mainly made of epoxy resin, BT resin, or ABF resin. Its CTE (coefficient of thermal expansion) is about 13 to 17ppm /℃Flex IC substrate: It is mainly made of PI or PE resin and has CTE 13 to 27ppm / ℃·Ceramic IC substrate: It

Substrate PCB requires more requirements than standard PCB and HDI PCB. Manufacturers must have advanced manufacturing capabilities and be proficient in them.The most important feature of IC substrate structure is micro through holeIC substrate production process is complex, and the MSAP process is the mainstream. The minimum line width/spacing of IC substrate is generally less than 30 μ M. the traditional subtraction process has been difficult to meet the requirements of IC substrate. MSAP is the most common process for IC substrate manufacturing. In addition to being widely used in IC substrate manufacturing, MSAP technology is also introduced into SLP (substrate-like) manufacturing by apple. The current design is to use a mixture of reduced etching and MSAP process, MSAP process can be applied to thinner, smaller motherboard design.The barriers of the IC substrate industry are high, not limited to the technical threshold. High technical requirements and numerous patent restrictions have created a high threshold of the IC substrate industry, and the barriers of the industry also include capital and customers. Capital Barrier of IC substrate Due to the high technical barriers of the IC substrate board, the initial R & D investment is huge and time-consuming, and the development risk of the project is high. The construction and subsequent operation of the IC substrate board production line also need huge capital investment, among which the capital investment of equipment is the largest. There are many devices in the IC substrate production line, and the price of a single device may exceed 10 million yuan. The equipment/instrument investment accounts for more than 60% of the total investment of the IC substrate projects, which is a heavy burden for traditional PCB manufacturers. Taking Fast Print technology as an example, the company launched the IC substrate project in 2012, with a total investment of more than 400 million yuan. It is estimated that the project will reach its production capacity in three years, and the annual output value will be about 500 million yuan after it reaches its production capacity. However, the company's IC substrate project is difficult to carry out in the

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